层叠式封装
层叠式封装（英语：Package on Package，简称PoP），是一种集成电路封装技术。此技术是将两个或更多元件，以垂直堆叠或是背部搭载的方式，在底层封装中整合高密度的数位或混合讯号逻辑元件，在顶层封装中整合高密度或组合内存。PoP可超过两个以上的封装元件垂直堆叠。
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