Micro Leadframe Package (MLP) é uma família de circuitos integrados de encapsulamentoQFN, usado em montagem superficial de circuitos eletrônicos. Está disponível em três versões, a MLPQ (Q de Quad), MLPM (M de Micro) e MLPD (Dual). Estes encapsulamentos geralmente possuem o conector do die exposto para melhorar a performance térmica. O MLPD foi projetado para ser compatível e substituir os encapsulamentos SOIC.
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