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Socket 1366

Socket 1366
Specifikace
Typ paticeLGA
PouzdroFlip-chip pin grid array
Kontaktů1366
SběrniceIntel QuickPath Interconnect
Propustnost1× až 2× Quickpath
4,8 GT/s, 6,4 GT/s
ProcesoryCore i7 (2,66–3,2 GHz)

Patice 1366 (Socket 1366, Socket T, LGA 1366) je nástupcem Patice 775 v nejvyšším segmentu jakož i Patice 771 v low-endu. Je určena pro procesory Core i7Xeon – ty i v dvouprocesorových (2P) konfiguracích. Obsahuje 1366 kontaktů. A FSB nahrazuje nová Intel QuickPath Interconnect. Jejími nástupci jsou patice LGA  2011 a LGA  1356.

Externí odkazy

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Socket 1366
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